Title:
ELECTROLYTIC COPPER FOIL
Document Type and Number:
Japanese Patent JP2005175443
Kind Code:
A
Abstract:
To provide an electrolytic copper foil which has a high etching factor without reducing a peel strength and achieves a fine pattern without leaving copper particles on the base of a wiring pattern.
The electrolytic copper foil is an untreated electrolytic copper foil. A deposition surface of the untreated copper foil has a surface roughness RZ of 2.1 or less which is equal to or smaller than that of a glossy surface of the untreated copper foil. The electrolytic copper foil is electrolytically formed by using a compound having a mercapto group, a chloride ion, and an electrolytic solution where a low molecular weight glue with a molecular weight of 10000 or less and a polymer polysaccharide are added.
Inventors:
WOLSKI ADAM M
STREEL MICHEL
SUZUKI AKITOSHI
OTSUKA HIDEO
STREEL MICHEL
SUZUKI AKITOSHI
OTSUKA HIDEO
Application Number:
JP2004311533A
Publication Date:
June 30, 2005
Filing Date:
September 29, 2004
Export Citation:
Assignee:
FURUKAWA CIRCUIT FOIL KK
International Classes:
H05K1/09; C25D1/00; C25D1/04; C25D3/38; (IPC1-7): H05K1/09; C25D1/00; C25D1/04; C25D3/38