Title:
ELECTROLYTIC COPPER FOIL
Document Type and Number:
Japanese Patent JP2013167025
Kind Code:
A
Abstract:
To provide an electrolytic copper foil having small surface roughness, and capable of controlling formation of any "elongation wrinkle" or any discolored stripe along the longitudinal direction by attaining the uniform thickness in the width direction and in the longitudinal direction thereof.
In an electrolytic copper foil, the surface roughness Rz is ≤2.0 μm, and the foil thickness difference in the width direction is ≤1.5%. Further, in the electrolytic copper foil, the differential foil thickness in the width direction is ≤1.3%, and the dispersion of the roughness in the width direction (Rzmax-Rzmin)/Rzavg is ≤15%.
Inventors:
KOHIKI MICHIYA
Application Number:
JP2013093266A
Publication Date:
August 29, 2013
Filing Date:
April 26, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/04; C25D7/06
Domestic Patent References:
JP2012523535A | 2012-10-04 | |||
JP2012242129A | 2012-12-10 | |||
JP2012022939A | 2012-02-02 | |||
JP2010242129A | 2010-10-28 | |||
JPH0436489A | 1992-02-06 | |||
JPH0436491A | 1992-02-06 | |||
JPH0436494A | 1992-02-06 | |||
JP2002004095A | 2002-01-09 | |||
JP2009221592A | 2009-10-01 | |||
JP2007146289A | 2007-06-14 | |||
JP2004026328A | 2004-01-29 |
Attorney, Agent or Firm:
Isamu Ogoshi
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