Title:
ELECTROLYTIC COPPER FOIL
Document Type and Number:
Japanese Patent JP2015014051
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electrolytic copper foil having small surface roughness, and capable of controlling formation of "elongation wrinkle" or discolored stripe along a longitudinal direction by attaining the uniform thickness in a crosswise direction and in the longitudinal direction.SOLUTION: In an electrolytic copper foil, the surface roughness Rz is ≤2.0 μm, and the foil thickness difference in the width direction is ≤1.5%. Further, in the electrolytic copper foil, the differential foil thickness in the width direction is ≤1.3%, and the dispersion of the roughness in the width direction (Rzmax-Rzmin)/Rzavg is ≤15%.
Inventors:
KOHIKI MICHIYA
Application Number:
JP2014215708A
Publication Date:
January 22, 2015
Filing Date:
October 22, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/04
Domestic Patent References:
| JP2010242129A | 2010-10-28 | |||
| JP2002004095A | 2002-01-09 | |||
| JP2009221592A | 2009-10-01 | |||
| JP2007146289A | 2007-06-14 | |||
| JPH0436489A | 1992-02-06 | |||
| JPH0436491A | 1992-02-06 | |||
| JPH0436494A | 1992-02-06 | |||
| JP2004263289A | 2004-09-24 |
Foreign References:
| WO2012066991A1 | 2012-05-24 |
Attorney, Agent or Firm:
Axis international patent business corporation
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