Title:
パラジウム銅合金剥離箔形成用電解パラジウム銅合金めっき液
Document Type and Number:
Japanese Patent JP7133199
Kind Code:
B2
Abstract:
To provide an electrolytic palladium-copper alloy plating solution for forming a palladium-copper alloy peeling foil, having such features that: peelability from a metal substrate having an oxide film on a surface is good; after peeling from the metal substrate, it is flexible and has less warping (curl); there are few defects such as pin holes and cracks; even if annealing is not performed after plating, it has a uniform alloy composition in a thickness direction of the foil: and there is little difference in the alloy ratio between the front and back.SOLUTION: An electrolytic palladium-copper alloy plating solution according to the present invention contains (A) palladium (II) ammine complex salt, (B) copper (II) salt, (C) a pyrophosphate compound and/or tripolyphosphate compound, (D) a tetravalent selenium compound, and (E) a pyridine sulfonic acid compound. The molar concentration of (C) is adjusted to 0.35 mol/L or more and 1.1 mol/L or less, the value obtained by dividing the molar concentration of the compound belonging to (C) by the molar concentration of copper is adjusted to 4.8 or more to 23.2 or less, and the pH is adjusted to 7.5 or more to 9.5 or less.SELECTED DRAWING: None
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Inventors:
Kazuya Shibata
Kazumasa Kobayashi
Kazumasa Kobayashi
Application Number:
JP2018097495A
Publication Date:
September 08, 2022
Filing Date:
May 22, 2018
Export Citation:
Assignee:
Nippon Kojundo Chemical Co., Ltd.
International Classes:
C25D1/04; C25D1/00; C25D3/50
Domestic Patent References:
| JP2001172732A | ||||
| JP2000303199A |
Foreign References:
| WO2015194472A1 |
Attorney, Agent or Firm:
Patent Business Corporation Takahashi International Patent Office