To provide an electrolytic polishing method and apparatus by which electrolytic polishing and mechanical polishing are simultaneously performed.

In the electrolytic polishing method where workpieces 1, 2 are immersed into an electrolytic solution 3, and voltage is applied to a space among the electrolytic solution 3 and the workpieces 1, 2 so as to electrolytically polish the workpieces 1, 2, the pair of workpieces 1, 2 are immersed into the electrolytic solution 3 which does not comprise abrasives, further, the workpieces 1, 2 are arranged so as to be confronted via the electrolytic solution 3, grinding is caused by driving at least either workpiece in such a manner that the faces to be worked confronted via the electrolytic solution 3 relatively move to the facial directions thereof, also, voltage is applied to a space between the electrolytic solution 3 and either workpiece, and polishing is performed.