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Title:
ELECTROLYTIC SOLUTION FOR PRODUCING ELECTROLYTIC COPPER FOIL AND ELECTROLYTIC COPPER FOIL
Document Type and Number:
Japanese Patent JP2013204088
Kind Code:
A
Abstract:

To provide an electrolytic solution for producing electrolytic copper foil for producing an electrolytic copper foil that has tensile strength after heat treatment at 300°C for 1 hour of 450 MPa or more and the electric conductivity of 80% or more.

An electrolytic solution for producing electrolytic copper foil is prepared by adding tungsten or tungsten compound such as tungstic acid and thiourea type compound, as necessary, chlorine ion into an electrolytic solution. A copper foil is produced by using the electrolytic solution for producing electrolytic copper foil. Thus, tungsten is taken into a copper foil and an electrolytic copper foil that has tensile strength after heat treatment at 300°C for 1 hour of 450 MPa or more and the electric conductivity of 80% or more can be produced.


Inventors:
EZURA KEN
SHINOZAKI KENSAKU
SUZUKI AKITOSHI
FUJISAWA KIMIKO
Application Number:
JP2012074173A
Publication Date:
October 07, 2013
Filing Date:
March 28, 2012
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C25D1/00; C25D1/04; C25D3/58
Attorney, Agent or Firm:
Takahisa Sato