Title:
電解処理装置および電解処理方法
Document Type and Number:
Japanese Patent JP6789321
Kind Code:
B2
Abstract:
An electrolytic treatment apparatus 1 (1A) configured to perform an electrolytic treatment on a target substrate includes a substrate holder 10 and an electrolytic processor 20. The substrate holder 10 includes an insulating holding body 11 configured to hold the target substrate and an indirect negative electrode 12 disposed within the holding body 11. A negative voltage is applied to the indirect negative electrode 12. The electrolytic processor 20 is disposed to face the substrate holder 10 and configured to apply a voltage to the target substrate and an electrolyte in contact with the target substrate.
Inventors:
Tomohisa Hoshino
Hama Masato Taba
Toshiyuki Matsumoto
Hama Masato Taba
Toshiyuki Matsumoto
Application Number:
JP2018566048A
Publication Date:
November 25, 2020
Filing Date:
January 18, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C25D17/10; C25D5/18; C25D17/00; C25D17/06; C25D21/00; C25D21/12; C25D21/14
Foreign References:
| WO2015104951A1 | ||||
| WO2017094568A1 |
Attorney, Agent or Firm:
Sakai International Patent Office
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