Title:
高温寸法安全性及び集合組職安全性を有する電解銅箔及びその製造方法
Document Type and Number:
Japanese Patent JP7083029
Kind Code:
B2
Abstract:
The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 µm/(m·°C) in a temperature regionof 30-190°C, has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190°C, and has a weight deviation of 5% or less in the transverse direction.
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Inventors:
Kim Seung Min
Anjun Kyu
Jin Shan Hwa
Anjun Kyu
Jin Shan Hwa
Application Number:
JP2020539249A
Publication Date:
June 09, 2022
Filing Date:
January 25, 2019
Export Citation:
Assignee:
SK Nexilis Company Limited
International Classes:
C25D1/04; C25D1/00
Domestic Patent References:
| JP2006168365A | ||||
| JP2003101176A | ||||
| JP2012022939A | ||||
| JP2009138245A | ||||
| JP2017079208A | ||||
| JP2017101320A | ||||
| JP2000256866A | ||||
| JP2001140091A | ||||
| JP2018063938A | ||||
| JP6146052A | ||||
| JP2013060660A | ||||
| JP2017095807A | ||||
| JP2012169597A |
Foreign References:
| WO2016208869A1 | ||||
| US20140057170 | ||||
| CN101135058A |
Other References:
Woo, T.-G., et al.,"The effect of surface morphology and crystal structure on the thickness of copper foil",Journal of Korean Institute of Metals and Materials,2007年08月,Vol. 45, No. 8,pp. 478-483
Attorney, Agent or Firm:
Satoshi Watanabe
Kazuko Fujita
Kazuko Fujita