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Patent Searching and Data


Title:
ELECTROMAGNETIC FLOW COUPLER
Document Type and Number:
Japanese Patent JPS62268354
Kind Code:
A
Abstract:

PURPOSE: To increase flow rate at electromagnetic pump side and to improve the pump efficiency and to eliminate influence of thermal stress strain, by a method wherein a duct section of generating side is as wide as a half of that of electromagnetic pump side or less and arranged in parallel, and a combination of both duct is floated in the outside duct.

CONSTITUTION: Magnetic field is applied to a generating duct section I from arrow A direction and liquid metal flows in arrow B direction, thereby current is induced in arrow C direction. This current flows through a protective conduction material 24 and a conduction material 23 into a duct section II at electromagnetic pump side so that the liquid metal within the duct section II at electromagnetic pump side is driven in arrow F direction. On both sides of the duct section 1 is arranged the duct section 11, and if the former is as wide as a half of the latter or less, flow rate at electromagnetic pump side exceeds that at the generating duct section. Since the combined structure of the duct section I and the duct section 11 is floated in the outside duct I through the liquid metal, thermal strain produced by the temperature difference between the duct section I and the duct section II is not transmitted to the outside duct I.


Inventors:
TAKAGI TAKASHI
Application Number:
JP1986000108963
Publication Date:
November 20, 1987
Filing Date:
May 13, 1986
Export Citation:
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Assignee:
CENTRAL RES INST ELECT
MITSUBISHI HEAVY IND LTD
MITSUBISHI ELECTRIC CORP
International Classes:
H02K44/04; H02K44/02; (IPC1-7): H02K44/04