Title:
ELECTROMAGNETIC INTERFERENCE SEALED MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2005285923
Kind Code:
A
Abstract:
To provide an electromagnetic interference sealed molded article at a low cost, that is superior in electromagnetic wave shielding properties, moldability, adhesion stability, and external apparance.
The electromagnetic interference sealed molded article is provided with a conductive member that is formed in a portion of 10% or lower of the total surface area of the molded article containing conductive fiber. In this case, the conductive member is jointed integrally with the surface of the molded article.
Inventors:
SHIHO KOSUKE
TANISUGI HIDEAKI
HASEGAWA KOJI
TANISUGI HIDEAKI
HASEGAWA KOJI
Application Number:
JP2004094754A
Publication Date:
October 13, 2005
Filing Date:
March 29, 2004
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
H05K9/00; (IPC1-7): H05K9/00