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Title:
ELECTROMAGNETIC PUMP FOR LIQUID METAL
Document Type and Number:
Japanese Patent JP2013220441
Kind Code:
A
Abstract:

To prevent breakage of an electromagnetic pump by reducing thermal stress and thermal strain especially generated in a part between a liquid metal inlet 17 of a pump side duct 1 and a bottom surface of a liquid metal bath 10 when solidified metal in the liquid metal bath 10 is expanded in remelting the liquid metal after solidification and contraction.

An inductor 5 generating a shifting magnetic field inside a pump side duct 1 is arranged on an outer circumference of the cylindrical pump side duct 1 which passes liquid metal. The inductor 5 is covered by a protecting case 11 and is immersed in the liquid metal 12. A clearance t between a liquid metal inlet 17 and a bottom surface of a liquid metal bath 10 for housing the liquid metal 12 is t≤0.0006D2+0.6114D-40 (mm) with respect to a nominal diameter DA (called A) of the liquid metal bath 10.


Inventors:
Miura, Kuniaki
Hagitani, Kazuhiko
Tomita, Michihiro
Application Number:
JP2012000093444
Publication Date:
October 28, 2013
Filing Date:
April 17, 2012
Export Citation:
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Assignee:
SUKEGAWA ELECTRIC CO LTD
International Classes:
B22D35/00; G21C15/247; H02K44/06
Domestic Patent References:
JP2009000688A2009-01-08
JPS5775563A1982-05-12
JPH06154775A1994-06-03
Foreign References:
US5205346A1993-04-27
US5205346A1993-04-27
Attorney, Agent or Firm:
北條 和由