ELECTROMAGNETIC WAVE ABSORBING ADHESIVE

Japanese Patent JPH1150029

A

PROBLEM TO BE SOLVED: To provide an electromagnetic wave absorbing adhesive capable of absorbing unnecessary electromagnetic wave of an electronic part in high efficiency and usable in a dead space enabling sufficient suppression of electromagnetic interference. SOLUTION: This electromagnetic wave absorbing heat-dissipation electronic part 10 is formed by bonding the joining face of an electronic part 2 such as IC, CPU or MPU to a heat-dissipation plate (heat sink) 3 with an electromagnetic wave absorbing pasty adhesive 1 composed of a freely shapeable viscous material. The electromagnetic wave absorbing adhesive 1 is produced by mixing an organic binder with a Sendust soft magnetic powder containing a silane coupling agent. The amount of the silane coupling agent is 0-10 wt.% (excluding zero) based on the Sendust soft magnetic powder. The electromagnetic wave absorbing adhesive 1 stably and efficiently absorbs unnecessary electromagnetic wave generated from the electronic part 2 to sufficiently suppress the electromagnetic interference and has high thermal conductivity to efficiently transmit the heat generated from the electronic part 2 to the heat-dissipation plate 3 to contribute to the promotion of heat-dissipation.

JP2002105430	FOAMING FLAME-RESISTANT ADHESIVE AND FINISHING METHOD USING THE SAME
WO/2000/036043	REMOVABLE EMULSION PRESSURE-SENSITIVE ADHESIVES
WO/2011/153893	COLORED JOINTING ADHESIVE FOR STONE

KAMEI KOJI
SATO MITSUHARU

JP21034897A

February 23, 1999

August 05, 1997

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TOKIN CORP

C09J9/00; C09J11/04; C09J11/06; C09J201/00; H05K9/00; (IPC1-7): C09J9/00; C09J11/04; C09J11/06; C09J201/00; H05K9/00

Yosuke Goto (2 outside)

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