Title:
ELECTROMAGNETIC WAVE ABSORBING HEAT CONVERSION CHIP
Document Type and Number:
Japanese Patent JP2014239172
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electromagnetic wave absorbing heat conversion chip which easily and efficiently suppresses an electromagnetic wave generated from a mobile phone.SOLUTION: There is provided an electromagnetic wave absorbing heat conversion chip for suppressing an electromagnetic wave generated during conversation on a mobile phone. This conversion chip includes: a flat-shaped magnetic substance obtained by baking and solidifying a ferrite material containing an iron oxide as a main component; a magnetic shield sheet made of a high-permeability nanocrystal soft magnetic material provided on the surface of the mobile phone to be deposited on the outer surface of a casing in the magnetic substance; an adhesive part for mobile phone deposition provided on the surface of the magnetic shield sheet; and release paper provided so as to cover the surface of the adhesive part.
Inventors:
MANABE KATSUTOSHI
NISHIKAWA SHUJI
NISHIKAWA SHUJI
Application Number:
JP2013121480A
Publication Date:
December 18, 2014
Filing Date:
June 10, 2013
Export Citation:
Assignee:
NIPPON AQUA LIFE KK
International Classes:
H05K9/00; H01F1/00; H01F1/14
Domestic Patent References:
| JP2001230105A | 2001-08-24 | |||
| JP2003163486A | 2003-06-06 | |||
| JP2000077890A | 2000-03-14 | |||
| JPH09298385A | 1997-11-18 | |||
| JP2000232297A | 2000-08-22 | |||
| JP2625485B2 | 1997-07-02 | |||
| JPH044393B2 | 1992-01-28 |
Attorney, Agent or Firm:
Miyazaki Eiji
Tomohiro Harada
Tomohiro Harada