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Title:
ELECTROMAGNETIC WAVE ABSORBING SHEET
Document Type and Number:
Japanese Patent JP2005223157
Kind Code:
A
Abstract:

To provide an electromagnetic wave absorbing sheet at a low cost which can cope with request for further thinning of small electronic apparatuses, such as digitized cellular phones, digital cameras and personal computers, can fully intercept electromagnetic waves of high long wavelength waves generated from these small electronic apparatuses, can sufficiently attain fire retardancy in these small electronic apparatuses, and further, will not generate harmful gas in the case of incineration treatment.

The electromagnetic wave absorbing sheet 10 is provided with (1) a substrate layer 1, which consists of high molecular compound which does not contain halogen element and whose thickness is 4-20 μm, (2) a soft magnetic layer 2 which is arranged on the surface of the substrate layer 1 and consists of a powder of soft magnetic metal and a binder composed of the high-molecular compound which does not contain halogen elements and whose thickness is 10-100 μm, and (3) a flame resisting layer 3, which is arranged on the surface of the soft magnetic layer 2 and consists of non-halogen based flame retarder and the binder composed of the high-molecular compound which does not contain halogen element and whose thickness is 6-70 μm. The overall thickness is set to 20-150 μm.


Inventors:
UTSUKI ITARU
YAMASHITA MASAMI
ASAKI KAZUMI
KICHISHIN TAKASHI
MEGURO TAKU
Application Number:
JP2004029858A
Publication Date:
August 18, 2005
Filing Date:
February 05, 2004
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
HITACHI METALS LTD
International Classes:
H05K9/00; (IPC1-7): H05K9/00
Attorney, Agent or Firm:
Hideo Takino
Hiroshi Ochi
Sadao Matsumura
Isamu Kakiuchi