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Title:
PALLADIUM PLATING SOLUTION
Document Type and Number:
Japanese Patent JPH0711476
Kind Code:
A
Abstract:

PURPOSE: To provide a palladium plating solution, with which a high purity, stable Pd deposit appropriately used in particular as a decorative material by adding specifies amounts of pyridinecarboxylic acid, its amine based derivative and an anionic surfactant to a plating solution contg. a specified amount of a soluble Pd salt.

CONSTITUTION: The palladium plating solution comprises 1.0 to 40.0g/l of a soluble Pd salt (A), 0.1 to 10.0g/l of pyridinecarboxylic acid (B), 0.1 to 10.0g/l of an amine based derivative of pyridinecarboxylic acid (C) and 0.001 to 0.1g/l of an anionic surfactant (D). Examples of the component A are dinitrodiaminepalladium and dinitrotetraminepalladium, etc. Examples of the component B are picolinic acid, nicotinic acid and isonicotinic acid, etc. Examples of the component C are nicotinic acid amide, picolinic acid amide and isonicotinic acid amide, etc. An example of the component D is sodium di-2-ethylhexylsulfosuccinate.


Inventors:
HASHIMOTO MAKIO
ARAI YOTARO
Application Number:
JP17463093A
Publication Date:
January 13, 1995
Filing Date:
June 23, 1993
Export Citation:
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Assignee:
KOJIMA KAGAKU YAKUHIN KK
International Classes:
C25D3/50; (IPC1-7): C25D3/50