Title:
ELECTROMAGNETIC WAVE SHIELD COVER
Document Type and Number:
Japanese Patent JP2021141192
Kind Code:
A
Abstract:
To obtain a laminated electromagnetic wave shield cover using an inexpensive and easy-to-handle material.SOLUTION: An electromagnetic wave shield cover according to the present invention includes an FRP cover member (30), first and second metal shield meshes (31 and 32) provided on both sides (30a and 30b) of the FRP cover member (30), first and second glass cloths (33 and 34) provided on the first and second outer surfaces (31a and 32a) of the first and second metal shield meshes (31 and 32), and the FRP cover member (30), the first and second metal shield meshes (31 and 32), and the first and second glass cloths (33 and 34) are laminated to each other.SELECTED DRAWING: Figure 3
Inventors:
SHIROTA SHINGO
Application Number:
JP2020037577A
Publication Date:
September 16, 2021
Filing Date:
March 05, 2020
Export Citation:
Assignee:
TAMAGAWA SEIKI CO LTD
International Classes:
H05K9/00; B32B3/24; B32B15/08; B32B17/04
Attorney, Agent or Firm:
Michiharu Soga
Kajinami order
Kazuhisa Tsukahara
Kajinami order
Kazuhisa Tsukahara