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Title:
ELECTROMAGNETIC WAVE SHIELD SHEET, AND METHOD OF MANUFACTURING ELECTROMAGNETIC WAVE SHIELD SHEET
Document Type and Number:
Japanese Patent JP2010147235
Kind Code:
A
Abstract:

To provide an electromagnetic wave shield sheet capable of efficiently removing an insulating member (transparent resin layer) provided on a surface of a conductive layer, having an easily understandable grounding area, and easily achieving an excellent electric connection from the conductive layer, and a method of manufacturing the electromagnetic wave shield sheet.

The method of manufacturing an electromagnetic wave shield sheet formed by sequentially laminating at least a conductive layer and a transparent resin layer on one side of a transparent substrate, includes: a step of forming the conductive layer on one side of the transparent substrate (i); a step of forming a transparent resin layer on a surface opposite to the transparent substrate side of the conductive layer (ii); a step of setting a colored layer forming area at the periphery of the transparent resin layer (iii); and a step of forming a colored layer in the colored layer forming area, on a surface opposite to the conductive layer side of the transparent resin layer and removing the colored layer and an area of the transparent resin layer directly below the colored layer by light (preferably, pulsed light) radiation to expose at least a part of the surface of the periphery of the conductive layer (iv).

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
OHASHI YOICHIRO
Application Number:
JP2008322627A
Publication Date:
July 01, 2010
Filing Date:
December 18, 2008
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H05K9/00; B32B37/00; G09F9/00
Attorney, Agent or Firm:
Kishimoto Tatsuto
Akihiko Yamashita