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Patent Searching and Data


Title:
ELECTROMAGNETIC WAVE SHIELD USING ELECTROFORMING
Document Type and Number:
Japanese Patent JP2011129845
Kind Code:
A
Abstract:

To produce and provide an electromagnetic wave shield that has precision of micron order of boring of a small hole inexpensively by electroforming.

The electromagnetic wave shield 1 is made of metal, and alloy thereof can be freely selected as long as it can be manufactured by electroforming. A solid which is a cube, a column, a sphere, or a combination thereof can be selected as the whole shape. A hole 2 for heat dissipation may be round, square, rhombic, polygonal, etc. A size of the hole may be freely selected as long as an electromagnetic wave does not leak. One surface of the solid is open, and a generation source for an electromagnetic wave and an electronic component which is vulnerable to the electronic wave can be covered.


Inventors:
KAMISAKA NAOHIKO
Application Number:
JP2009299407A
Publication Date:
June 30, 2011
Filing Date:
December 16, 2009
Export Citation:
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Assignee:
KAMISAKA NAOHIKO
International Classes:
H05K9/00; C25D1/00