To provide an electromagnetic wave shield capable of obtaining such high reliability that a junction property with a substrate consisting of a plastic material is more increased by improving the weather resistance or the like of an electromagnetic wave shielding film, so as to continuously hold high electromagnetic wave shielding capacity even under a high temperature and high humidity environment or the like mainly as an EMC measure material.

An electromagnetic wave shielding film 1 consists of an Ag alloy material obtained by adding Pd of 0.1-0.3 wt.% to Ag to be a main component, and adding at least one of elements Cu, Au, Ti, Cr, Ta, and Mo of 0.1-3.0 wt.%. The film 1 is formed on the surface of the substrate of the plastic material by a sputtering method or the like as a single film or two or more films in accordance with a purpose. Temperature and chemical stability can be obtained by forming an adhesion promoting ground film 3 for improving the adhesion of the film 1, and forming a protection film 4 having high corrosion resistance or the like. The shielding film 1 can be applied to various purposes capable of widely expecting application/development as the EMC measure material.