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Patent Searching and Data


Title:
ELECTROMAGNETIC WAVE SHIELDING BOARD
Document Type and Number:
Japanese Patent JP11054982
Kind Code:
A
Abstract:

To provide a board in which an electromagnetic wave shielding effect is provided to a board itself, and heating performance and antifungal properties are also held, and further which is favorable in points of weight and cost.

An electromagnetic wave shielding board, molded in a body by bonding a mesh-like electromagnetic wave shielding fiber 2 to the surface of a plaster material 1, and laminating another plaster material 3 containing anti-fungus agent on the electromagnetic wave shielding fiber 2, is employed as a basic structure. A hard plaster is used as one plaster material 1, and soft plaster is used as the another plaster material 3. Further, an example in which the mesh-like electromagnetic wave shielding fiber 2 and a mat-like glass fiber 4 are bonded on the surface of the plaster material, an example in which the electromagnetic wave shielding fiber 2 and a heater 5 for electric heat are bonded, and a constitution of the electromagnetic wave shielding board molded in a body by bonding all of the glass fiber 4 and the heater 5 for electric heat to the electromagnetic wave shielding fiber 2, and laminating the other plaster material 3, are provided.


Inventors:
Haga, Tadashi
Application Number:
JP1997000211476
Publication Date:
February 26, 1999
Filing Date:
August 06, 1997
Export Citation:
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Assignee:
YOSHINO SANGYO KK
International Classes:
E04B1/92; B32B7/02; B32B13/14; C04B28/14; H05K9/00; E04B1/92; B32B7/02; B32B13/00; C04B28/00; H05K9/00; (IPC1-7): H05K9/00; B32B7/02; B32B13/14; C04B28/14; E04B1/92