Title:
転写フィルム付電磁波シールドフィルム、転写フィルム付電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP7256618
Kind Code:
B2
Abstract:
To provide an electromagnetic wave shield film with a transfer film capable of making it difficult to form a gap between an adhesive layer of the electromagnetic wave shield film and a surface of a printed wiring board when manufacturing a shielded printed wiring board.SOLUTION: The electromagnetic wave shield film with a transfer film consisted of the transfer film and an electromagnetic wave shield film laminated on the transfer film, includes: a protective layer that contacts the transfer film; a shield layer laminated on the protective layer; and an adhesive layer laminated on the shield layer. The Young's modulus of the transfer film is 2.0 GPa or more.SELECTED DRAWING: Figure 1
Inventors:
Shigekazu Umemura
Application Number:
JP2018160342A
Publication Date:
April 12, 2023
Filing Date:
August 29, 2018
Export Citation:
Assignee:
Tatsuta Electric Wire Co., Ltd.
International Classes:
H05K9/00; B32B7/022; B32B7/025; H05K1/02
Domestic Patent References:
| JP2003298285A | ||||
| JP2012062351A | ||||
| JP2015199878A | ||||
| JP2017125184A | ||||
| JP2016115725A | ||||
| JP2015109404A |
Other References:
糸賀正明ほか3名、飽和ポリエステル樹脂ハンドブック、日刊工業新聞社、平成元年12月22日、694-700ページ
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus
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