Title:
ELECTROMAGNETIC WAVE SHIELDING MOLDING
Document Type and Number:
Japanese Patent JP2019161210
Kind Code:
A
Abstract:
To provide an electromagnetic wave shielding/absorbing molding superior in the ability to shield electromagnetic waves of a particular frequency.SOLUTION: An electromagnetic wave shielding/absorbing molding 10 comprises a thermoplastic resin composition containing a thermoplastic resin and carbon black. In the electromagnetic wave shielding/absorbing molding, the content of the carbon black in the molding is 7-50 mass%. The electromagnetic wave shielding/absorbing molding is 0.01-5 mm in thickness, has 10 dB or more in the effect of shielding electromagnetic waves at any frequency in a frequency region of 59-100 GHz, and 30% or more in the effect of absorbing electromagnetic waves at the frequency.SELECTED DRAWING: Figure 1
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Inventors:
UEDA TAKASHI
KATANO HIROTOMO
KATAYAMA HIROSHI
KATANO HIROTOMO
KATAYAMA HIROSHI
Application Number:
JP2018194177A
Publication Date:
September 19, 2019
Filing Date:
October 15, 2018
Export Citation:
Assignee:
DAICEL POLYMER LTD
International Classes:
H05K9/00; C08J3/22; C08K3/01; C08K3/04; C08L101/00; H01Q17/00
Domestic Patent References:
| JP2004327727A | 2004-11-18 | |||
| JP2001223492A | 2001-08-17 | |||
| JP2016210934A | 2016-12-15 | |||
| JP2001077584A | 2001-03-23 | |||
| JP2006173264A | 2006-06-29 | |||
| JP2016046483A | 2016-04-04 | |||
| JP2017141370A | 2017-08-17 |
Attorney, Agent or Firm:
Satoshi Furuya
Yoshitsune Kazumasa
Yoshitsune Kazumasa