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Title:
ELECTROMAGNETIC WAVE SHIELDING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS61115957
Kind Code:
A
Abstract:

PURPOSE: To provide the titled compsn. which gives moldings having an excellent electromagnetic wave shielding effect and excellent mechanical strength, consisting of a thermoplastic resin and a metallic short fiber having a specified length and a specified diameter produced by chattering cutting method.

CONSTITUTION: A metallic short fiber (e.g. brass fiber) which has a length of 0.1W3mm and in which diameter distribution is normal distribution, an average diameter is 20W90μ and standard deviation, σ is 10<σ<30, produced by chattering cutting method, is mixed with a thermoplastic resin (e.g. propylene resin) in a weight ratio of 3W7:7W3. If desired, 5W100pts.wt. (based on the quantity of the thermoplastic resin) filler (e.g. CaCO3), lubricant, coupling agent, flow improver, etc. are added thereto. Since said short fiber is well-dispersible in the thermoplastic resin, a molding of a uniform quality can be easily obtd. and the resulting moldings have an excellent electromagnetic wave shielding effect, even when a small amount of the metallic short fiber is incorporated therein.


Inventors:
SHIOBARA TOMOO
KAMIOMACHI HITOSHI
Application Number:
JP23695884A
Publication Date:
June 03, 1986
Filing Date:
November 09, 1984
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H05K9/00; C08K7/00; C08K7/02; C08L1/00; C08L7/00; C08L21/00; C08L23/00; C08L27/00; C08L51/00; C08L51/02; C08L101/00; (IPC1-7): C08K7/02; C08L101/00; H05K9/00
Domestic Patent References:
JPS59191747A1984-10-30



 
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