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Title:
ELECTRON BEAM-CURABLE POLYMERIZATION COMPOSITION AND ELECTRON BEAM CURED RESIN
Document Type and Number:
Japanese Patent JPH10101716
Kind Code:
A
Abstract:

To provide an electron beam-curable polymn. comps, which has improved transparency, heat, water and moisture resistances, antistatic property, and adhesion by incorporating a compd., contg. an ethylenic double bond, and a specified polythiol.

A compd. having two or more ethylenic double bond and a polythiol represented by the formula R-(SH)n (wherein R represents a polyvalent org. group; and n is 2 to 4) are mixed together in an aq. ratio of (3:1) to (1:3) to obtain an electron beam-curable polymn. compsn. This compsn. is applied onto one side of a 50 to 400μm-thick plastic film to a thickness of 1 to 1,000μm, followed by irradiation with an electron beam to conduct curing, thereby obtaining an electron beam-cured resin.


Inventors:
TAKUSHIMA SHUSUKE
UEKI KENSAKU
Application Number:
JP26083296A
Publication Date:
April 21, 1998
Filing Date:
October 01, 1996
Export Citation:
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Assignee:
ASAHI OPTICAL CO LTD
International Classes:
C08F2/38; C08F2/46; C08F18/14; C08F18/24; C08F20/20; (IPC1-7): C08F2/38; C08F2/46; C08F18/14; C08F18/24; C08F20/20
Attorney, Agent or Firm:
Kunio Miura