Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
電子ビーム溶接装置
Document Type and Number:
Japanese Patent JP5610727
Kind Code:
B2
Inventors:
仙入 克也
奥田 剛久
Application Number:
JP2009188355A
Publication Date:
October 22, 2014
Filing Date:
August 17, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
三菱重工業株式会社
International Classes:
B23K15/00; B23K15/06
Attorney, Agent or Firm:
Takaharu Fujita
Ueda Kunio



 
Previous Patent: 電気モータ

Next Patent: ELASTIC SURFACE WAVE ELEMENT DEVICE