To provide an electronic apparatus equipped with a plurality of semiconductor chips, which can improve the yield of the electronic apparatus; and to provide its manufacturing method.

The electronic apparatus has a plurality of semiconductor devices 11-1, 11-2, 11-3 each of which has: a sealing resin 16 for sealing a semiconductor chip 14 having an electrode pad 23; a connecting terminal 17 protruding from the lower surface 16A of the sealing resin 16; and a metal wire 18 which electrically connects the electrode pad 23 with the connecting terminal 17 and is sealed by the sealing resin 16. A recessed part 26 for exposing part of the metal wire 18 and for housing the connecting terminals 17 of other semiconductor devices 11-2, 11-3 is provided in the upper part of the sealing resin 16. A plurality of the semiconductor devices 11-1, 11-2, 11-3 are stacked. The metal wire 18 in a portion exposed from the recessed part 26 is electrically connected with the connecting terminals 17 provided in the other semiconductor devices 11-2, 11-3.