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Patent Searching and Data


Title:
ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2004128318
Kind Code:
A
Abstract:

To provide a mounted structure of an electronic parts mounting board and electronic apparatus having the structure capable of preventing bending of the electronic parts mounting board, and shortening the mounting time.

Stays 9, 10, and 11 are arranged on an electronic parts mounting board 5 so as to be extended in directions reaching both end parts, and the stays 9 and 10 are connected to the board by a board connecting part arranged at the board abutting side of the stays, and butted to the top panel back surface of a casing by the top panel butting part of the stays 9 and 10 so as to be connected to the casing.


Inventors:
Watanabe, Tsutomu
Fujita, Takashi
Application Number:
JP2002000292364
Publication Date:
April 22, 2004
Filing Date:
October 04, 2002
Export Citation:
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Assignee:
YAMAHA CORP
International Classes:
H05K5/02; H05K1/02; H05K7/14; H05K1/18; (IPC1-7): H05K7/14; H05K5/02
Attorney, Agent or Firm:
三枝 英二
掛樋 悠路
小原 健志
中川 博司
舘 泰光
斎藤 健治
藤井 淳
関 仁士
中野 睦子