Title:
ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2012060029
Kind Code:
A
Abstract:
To enhance reliability of mounting by equalizing the fluid pressure due to ACF flow during ACF thermocompression when an IC chip is COG-mounted.
In the arrangement of output bumps of an IC chip 1, a bump group 12 where the bumps are staggered to rise right-ward and a bump group 11 where the bumps are staggered to rise leftward are formed so that the fluid pressure of ACF flow is applied uniformly, and arranged on the IC chip 1 evenly left and right.
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Inventors:
FUJITA HIROYUKI
Application Number:
JP2010203574A
Publication Date:
March 22, 2012
Filing Date:
September 10, 2010
Export Citation:
Assignee:
SEIKO INSTR INC
International Classes:
H01L21/60; G09F9/00
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura
Noriaki Uchino
Nobuyuki Kimura