Title:
ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2018107630
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic apparatus with a new structure that contributes to miniaturization.SOLUTION: An electronic apparatus comprises: a first substrate 12A; a second substrate 12B; and a resin housing 11. The resin housing 11 is formed with wiring that includes a signal line for electrically connecting the first substrate 12A and the second substrate 12B. The wiring formed on the resin housing may include the ground. The wiring may further include a connection member that connects at least one of the first substrate 12A and second substrate 12B and the signal line, and a ground member that connects at least one of the first substrate 12A and second substrate 12B and the ground.SELECTED DRAWING: Figure 1
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Inventors:
HIRAMATSU NOBUKI
NISHISAKA NAOKI
NISHIZONO MITSUHIRO
DJUNIADI SAGALA
NISHISAKA NAOKI
NISHIZONO MITSUHIRO
DJUNIADI SAGALA
Application Number:
JP2016252026A
Publication Date:
July 05, 2018
Filing Date:
December 26, 2016
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01P3/00; H01P1/04; H01P5/02; H01P5/08; H01P11/00; H01Q1/24; H01Q1/38; H04M1/02
Domestic Patent References:
| JP2012044640A | 2012-03-01 | |||
| JP2008005037A | 2008-01-10 |
Foreign References:
| WO2012074100A1 | 2012-06-07 |
Attorney, Agent or Firm:
Kenji Sugimura
Masahiro Ota
Toshiki Suzuki
Masahiro Ota
Toshiki Suzuki