PURPOSE: To enhance a heat-dissipating property in an electronic apparatus by a method wherein a heat sink is formed so as to be bent in a shape which covers a heat-generating element from a plurality of directions.

CONSTITUTION: An electronic apparatus is constituted of a circuit board 1, of a terminal board 2, of a package component 3 in which two heat-generating elements are internally mounted so as to be a module, of heat sinks 4A, 4B and of a case 5 which incorporates them. Then, the two heat-generating elements which have been internally mounted in the package component 3 are set to a state that they are connected thermally to the two heat sinks 4A, 4B which are completely separated by an isolation groove. Then, heat from the individual heat-generating elements is conducted respectively independently to the right and left heat sinks 4A, 4B. The right and left separated heat sinks 4A, 4B form large heat-dissipating walls on three faces along the inside of the case 5, and the heat from the heat-generating elements is dissipated with good efficiency.