Title:
ELECTRONIC ASSEMBLY WITH HEAT SINK
Document Type and Number:
Japanese Patent JP2001135963
Kind Code:
A
Abstract:
To enhance heat exchanging between a printed-circuit board and a sole plate, using a simple structure and at a low cost.
A heat-conductive electrical insulating material 6 is arranged in a region to the support surface of a sole plate 1, the material is pinched between a printed circuit board 2 and the sole plate 1, and compressive stress is applied to the heat-conductive and electrically insulating material 6 by the printed circuit board 2 and the sole plate 1.
Inventors:
Prajescu, Adrian
Duarte, Marc
Nicolai, Jean-marc
Duarte, Marc
Nicolai, Jean-marc
Application Number:
JP2000000288269
Publication Date:
May 18, 2001
Filing Date:
September 22, 2000
Export Citation:
Assignee:
VALEO VISION
International Classes:
H05K3/00; H05K7/20; H05K1/02; H05K3/34; (IPC1-7): H05K7/20