PURPOSE: To provide an electronic chip component housing body which can suck electronic components properly and positively and has a high chip mounting rate even if a tip surface of a suction nozzle of an automatic mounting machine completely covers an upper opening of an electronic component housing empty chamber part.

CONSTITUTION: The title item consists of a carrier tape 1 where bottom tape 2 is applied to a lower surface and a plurality of electronic component housing empty chamber parts 11 with the bottom tape 2 as the bottom surface are provided and a cover tape 3 which is applied to the upper surface of the carrier tape and closes the upper opening of the electronic component housing empty chamber parts 11 and then an air circulation hole 4 which communicates with the electronic component housing empty chamber parts 11 is provided at the bottom tape 2.