Title:
ELECTRONIC CIRCUIT DEVICE INCLUDING SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP3147157
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic circuit device, which can satisfactorily protect the semiconductor element having a bump electrode, has superior moisture resistance and is capable of satisfactorily obtaining the electrical characteristics for a long period.
SOLUTION: A first protective resin layer 5a comprising epoxy resin is provided between a main body part 2a of a semiconductor element, having a bump electrode 1 arranged on a circuit substrate 3 and the circuit substrate 3. A second protective resin layer 6 comprising silicone rubber is provided, so as to cover the upper surface of the main body part 2a of the semiconductor element 2 and the connecting part of a metal thin wire 8. The circuit substrate 3 is arranged on a metal supporting plate 11 and covered with a resin sealing body 12 made of epoxy resin. The hardness of the first protecting resin layer 5a is made higher than the hardness of the second protective resin layer 6.
Inventors:
Shigeo Yoshizaki
Application Number:
JP35233297A
Publication Date:
March 19, 2001
Filing Date:
December 05, 1997
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L21/60; H01L23/29; H01L23/31; (IPC1-7): H01L21/60; H01L23/29
Domestic Patent References:
| JP10107086A | ||||
| JP4211150A | ||||
| JP3224245A | ||||
| JP6094744A |
Attorney, Agent or Firm:
Noritsugu Takano
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