Title:
電子回路装置
Document Type and Number:
Japanese Patent JP5545334
Kind Code:
B2
Abstract:
For an electronic circuit apparatus including a shunt resistor, provided is a measure for improving the heat dissipation performance of the shunt resistor. The shunt resistor (12) includes electrodes (12a) and (12b) at both ends. One (12b) of the two electrodes is connected to a surface-mounting pattern (13R) on which the shunt resistor (12) is surface-mounted. A current-generating-side pattern (16) and a current-receiving-side pattern (17) are arranged separately from the surface-mounting pattern (13R). The current-generating-side pattern (16) and the surface-mounting pattern (13R) are connected together via a connection member (20) which creates a space between itself and a substrate.
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Inventors:
Rei Kondo
Mitsuhiro Tanaka
Yoshitsugu Koyama
Mitsuhiro Tanaka
Yoshitsugu Koyama
Application Number:
JP2012201138A
Publication Date:
July 09, 2014
Filing Date:
September 13, 2012
Export Citation:
Assignee:
Daikin Industries, LTD.
International Classes:
H01C1/084; H01C13/00
Attorney, Agent or Firm:
Patent business corporation MAEDA PATENT OFFICE
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