Title:
ELECTRONIC CIRCUIT ELEMENT FORMING APPARATUS AND ELECTRONIC CIRCUIT ELEMENT FORMING METHOD
Document Type and Number:
Japanese Patent JP2012114171
Kind Code:
A
Abstract:
To provide an apparatus and a method that can form an electronic circuit element having a desired electrical characteristic on a substrate.
The electronic circuit element forming apparatus or method injects a particle mixture toward a portion of a surface of a substrate 6 irradiated with a laser beam into a semi-molten or molten state. This forms an electronic circuit element 7 shaped in a specified locus on the surface of the substrate 6. The mixture ratio of a plurality of substances in the particle mixture can be controlled as a specified factor to control electrical characteristics of the electronic circuit element 7, such as electrical conductivity.
Inventors:
SUZUKI KATSUHIKO
Application Number:
JP2010260601A
Publication Date:
June 14, 2012
Filing Date:
November 22, 2010
Export Citation:
Assignee:
INST NAT COLLEGES TECH JAPAN
International Classes:
H05K3/10; C23C24/04
Domestic Patent References:
| JP2009235427A | 2009-10-15 | |||
| JP2009280874A | 2009-12-03 | |||
| JP2003277948A | 2003-10-02 |
Foreign References:
| WO2002036855A1 | 2002-05-10 | |||
| US20040043230A1 | 2004-03-04 | |||
| WO2002036855A1 | 2002-05-10 | |||
| US20040043230A1 | 2004-03-04 |
Attorney, Agent or Firm:
Creation International Patent Office
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