Title:
ELECTRONIC CIRCUIT MODULE BOARD AND ELECTRONIC CIRCUIT MODULE USING SAME
Document Type and Number:
Japanese Patent JP3174957
Kind Code:
B2
Abstract:
PURPOSE: To securely bring a terminal part patterned on a terminal forming pattern into contact with a circuit pattern of a flat mother board by forming the terminal forming pattern to expand by a constant height from a rear face of a main part.
CONSTITUTION: A board 12 of an electronic circuit module 11 has a terminal forming part 14 integrally formed which expands toward a rear face by a constant height on a periphery of the rear side of a flat main part 13 which looks rectangular viewed from a plane. A surface of the main part 13 is flat, where a wiring pattern 16 suitable for packaging a soldering part is formed. On the other hand a wiring pattern 17 is formed also on a center flat face surrounded by the expanding terminal forming part 14 on the rear face of the main part 13. The surface wiring pattern 16 and the rear wiring pattern 17 are electrically connected with each other by a through hole 18 passing through the main part 13. Thus a terminal part on a module substrate is in direct contact with a circuit pattern on a mother board, providing electric conductivity between them.
Inventors:
Takashi Kobayashi
Noboru Takayama
Noboru Takayama
Application Number:
JP25206391A
Publication Date:
June 11, 2001
Filing Date:
September 30, 1991
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L25/00; H01L23/12; H05K1/00; H05K3/34; H05K3/36; (IPC1-7): H01L25/00; H01L23/12
Domestic Patent References:
| JP4212446A | ||||
| JP59104540U | ||||
| JP531256U |
Attorney, Agent or Firm:
Minoru Yoshida