Title:
電子回路および半導体装置
Document Type and Number:
Japanese Patent JP4046528
Kind Code:
B2
Inventors:
Hiroyuki Sekiyama
Application Number:
JP2002084766A
Publication Date:
February 13, 2008
Filing Date:
March 26, 2002
Export Citation:
Assignee:
富士通株式会社
International Classes:
G06F1/12; G06F1/06; H03K5/00; H03K21/00
Domestic Patent References:
| JP2001313631A | ||||
| JP11345053A | ||||
| JP7321646A | ||||
| JP10056362A |
Attorney, Agent or Firm:
Takeshi Hattori