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Patent Searching and Data


Title:
ELECTRONIC COMPONENT AUTOMATIC INSTALLATION APPARATUS
Document Type and Number:
Japanese Patent JP2002026584
Kind Code:
A
Abstract:

To provide an electronic component automatic installation apparatus which can supply a large number of electronic components and install them at a high speed.

A component supplying section comprises: a component transportation path 112 for supplying electronic components in an aligned state; and a separation and delivery means 20 which separates a specified plural number of electronic components out of a plurality of electronic components stored in the component transportation path, and then delivers the separated electronic components to a component installation section. The component installation section comprises: a path means 20 which receives a specified plural number of electronic components from the component supplying section and stores them, and at the same time, sends electronic components left over after installation of electronic components back to the component supplying section; a movement means 8 which moves the path means to a component installation position on a printed wiring board 10, and then moves it back to the component supplying section after installation of electronic components; a positioning means 8 which fetches the electronic components stored in the path means one by one and then positions them on specified places on the printed wiring board; and a component installation means for installing the positioned electronic components at specified places one by one.


Inventors:
SHIMADA KATSUMI
SHODA DAIZO
Application Number:
JP2000210892A
Publication Date:
January 25, 2002
Filing Date:
July 12, 2000
Export Citation:
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Assignee:
POPMAN KK
International Classes:
H05K13/02; H05K13/00; H05K13/04; (IPC1-7): H05K13/02; H05K13/00; H05K13/04
Attorney, Agent or Firm:
Minoru Nakamura (10 outside)