Title:
電子部品内蔵基板及びその製造方法
Document Type and Number:
Japanese Patent JP7363158
Kind Code:
B2
Abstract:
To prevent separation of a via conductor for heat discharge in an electronic component built-in substrate with an electronic component such as a semiconductor IC buried therein.SOLUTION: An electronic component built-in substrate 1 includes: a substrate having wire layers L1 to L4 and insulating layers 11 to 14; an electronic component 40 buried in the substrate, the electronic component having a back surface 44 covered with a metal laminate film 50; a via conductor 35 connecting the wire layer L4 and the metal laminate film 50 to each other. The metal laminate film 50 has a laminate structure including highly adhesive metal films 51 and 52 and a metal film 53 between the metal films. The via conductor 35 penetrates the metal film 52 and extends into the metal film 53. Since the highly adhesive metal films 51, 52 are formed on both sides of the metal laminate film 50 and the back surface 44 of the electronic component 40 is covered by the metal laminate film and the via conductor 35 extends into the metal film 53, the via conductor 35 can be prevented from separating due to temperature change.SELECTED DRAWING: Figure 2
Inventors:
Ken Yokoyama
Toshiyuki Abe
Yoshihiro Suzuki
Kazutoshi Tsuyuya
Toshiyuki Abe
Yoshihiro Suzuki
Kazutoshi Tsuyuya
Application Number:
JP2019135918A
Publication Date:
October 18, 2023
Filing Date:
July 24, 2019
Export Citation:
Assignee:
TDK Corporation
International Classes:
H05K3/46; H01L23/12; H01L23/14
Domestic Patent References:
| JP2007150002A | ||||
| JP2006339354A | ||||
| JP2013219247A |
Attorney, Agent or Firm:
Mitsuhiro Washito
Ogata Japanese
Ogata Japanese
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