Title:
ELECTRONIC COMPONENT DEVICE
Document Type and Number:
Japanese Patent JPS5419661
Kind Code:
A
Abstract:
PURPOSE: To improve heat radiating characteristic, prevent the occurence of warpage and improve reliability by placing an electronic component element such as semiconductor chip on an Al plate, ihardening the circumference with resin, again disposing an Al plate and integrating the device.
Inventors:
ICHIKAWA OSAMU
MUKAI NOBUO
MUKAI NOBUO
Application Number:
JP8487277A
Publication Date:
February 14, 1979
Filing Date:
July 15, 1977
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H05K5/00; H01L23/00; H01L23/02; H01L23/28; H05K1/18; H05K5/06; (IPC1-7): H01L23/00; H01L23/30; H05K1/18