Title:
ELECTRONIC COMPONENT ELEMENT ASSEMBLY AND METHOD FOR MOUNTING THE ASSEMBLY
Document Type and Number:
Japanese Patent JP3933849
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an electronic component element assembly and a method for mounting the assembly which are advantageous for manufacturing, mounting work and improvement in mounting density.
SOLUTION: At least three or at least two kinds of electronic component elements 2a-2c, which include elements and electronic components, are formed on a single substratum 1. The electronic component elements 2a-2c are made to form an assembled plane 3 on the surface 4 of the substratum 1.
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Inventors:
Dai Yamauchi
Minoru Yamamoto
Minoru Yamamoto
Application Number:
JP2000199456A
Publication Date:
June 20, 2007
Filing Date:
June 30, 2000
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01C13/00; H01G4/40; H01C1/012; H01C7/00; H01C13/02; H01F27/00; H05K1/18; H05K3/34; (IPC1-7): H01G4/40; H01C7/00; H01C13/00; H01C13/02; H01F27/00; H05K1/18
Domestic Patent References:
| JP10214722A | ||||
| JP6041125U | ||||
| JP5082003U | ||||
| JP3289706A | ||||
| JP8138976A | ||||
| JP62096828U | ||||
| JP1192106A | ||||
| JP62279622A | ||||
| JP3166808A |
Attorney, Agent or Firm:
Masaru Ishihara