Title:
電子部品ハンドリング装置及び電子部品試験装置
Document Type and Number:
Japanese Patent JP7143246
Kind Code:
B2
Abstract:
An electronic component handling apparatus includes: a moving device that presses a device under test (DUT) against a socket of a test head. The moving device includes: a pusher that contacts the DUT; and a heater that heats the DUT through the pusher. The pusher includes: an internal space; and a first flow path that communicates with the internal space. Fluid from the test head is supplied to the internal space through the first flow path.
Inventors:
Yasuyuki Kato
Yuya Yamada
Shintaro Takagi
Hiroki Hosogai
Yuya Yamada
Shintaro Takagi
Hiroki Hosogai
Application Number:
JP2019096858A
Publication Date:
September 28, 2022
Filing Date:
May 23, 2019
Export Citation:
Assignee:
Advantest Corporation
International Classes:
G01R31/26
Domestic Patent References:
| JP2004527764A | ||||
| JP2000171520A | ||||
| JP2000180503A | ||||
| JP2002236140A |
Attorney, Agent or Firm:
Eternal patent business corporation