ELECTRONIC COMPONENT HOUSING TRAY - TAIHEIYO CEMENT CORP

Title:

ELECTRONIC COMPONENT HOUSING TRAY

Document Type and Number:

Japanese Patent JP2002128044

Kind Code:

A

Abstract:

To provide technique relating to an electronic component housing tray having electrical conductivity, heat resistance, and further light weight and sufficient shock resistance.

This electronic component housing tray is composed of a metal- ceramic composite material in which SiC powder of 20 to 80 volume % is included as a reinforcement material and Al-Si-Mg based aluminum alloys as a matrix.

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Inventors:

SHIOGAI TATSUYA
TSUTO HIROYUKI
TAKEI YOSHIBUMI
AOKI ICHIRO

Application Number:

JP2000331093A

Publication Date:

May 09, 2002

Filing Date:

October 30, 2000

Export Citation:

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Assignee:

TAIHEIYO CEMENT CORP

International Classes:

B65D1/00; B65D1/09; B65D85/86; C22C1/10; C22C21/00; C22C49/06; C22C101/14; (IPC1-7): B65D1/09; B65D85/86; C22C1/10; C22C21/00; C22C49/06

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