ELECTRONIC COMPONENT INSPECTION DEVICE AND PROGRAM

Japanese Patent JP3882891

B2

PROBLEM TO BE SOLVED: To accurately detect a chip and a protrusion which are shape defects on the outer circumference of an electronic component.
SOLUTION: The outer circumferential point coordinates of a picked up pattern of the electronic component such as an IC package are divided by sides by an outer circumferential point coordinate four side dividing means 8 and outer circumferential point coordinates by sides are calculated. The outer circumferential point coordinates per side are subjected to Hough transform within a search range of θ set by sides by a normal side detecting means 9. Normal straight lines by sides are detected by using a weighted least square linear approximation responding to an appearance frequency to a search area set around a maximum frequency point. Four intersections are determined from the normal straight lines by sides and a normal area using the four intersections as vertexes is calculated by a normal area calculating means 10. A chip is detected by a chip detecting means 29 by using a chip detection area prepared by a chip detection area preparing means 11 from the normal area. A protrusion is detected by a protrusion detecting means 15 by using a protrusion detection area prepared by a protrusion detection area preparing means 14 from the normal area.

Yukiko Hatakeyama
Masahiko Nagao

JP2001338993A

February 21, 2007

November 05, 2001

Click for automatic bibliography generation  

NEC

G01B11/02; G01B11/24; G01N21/956; G06T1/00; G06T7/60; (IPC1-7): G01B11/24; G01B11/02; G01N21/956; G06T1/00; G06T7/60

JP10213417A
JP2000090275A
JP8094541A
JP10049677A
JP2000163577A

Yusuke Omi

Previous Patent: MOTOR CONTROLLER AND RECORDER COMPRISING IT

Next Patent: ELECTROSTATIC CHARGE IMAGE DEVELOPER