PURPOSE: To simplify the connection between an electrode of a component in a package and a lead electrode with respect to an electronic component and its manufacture.

CONSTITUTION: A vessel is provided with a through hole 7; the through hole 7 at the inner face side of the vessel is sealed with a metallic foil 13; and an electrode 6 of the component is connected to the inner face side of the vessel of the metallic foil 13. Since the metallic foil is bonded to the electrode of the component directly via the through hole 7, it is not required to form a bump or the like or the connection, and the electrode of the component contained in the air-tight package is easily led out externally.