To provide an inexpensive electronic component with good hermeticity and manufacturable in a simple process and to provide a method for manufacturing this electronic component in a wafer state with good hermeticity.

This electronic component consists of a substrate 1, a circuit wiring 3 led out from functional element parts 3a and 3b formed on the substrate 1, a lid 4 with a recessed part 4a one side of which is arranged on the circuit wiring 3 to cover the functional element parts 3a and 3b, a stopper 5 provided in a crossing state over the circuit wiring 3 with a space a with the lid 4, and an adhesive body 8 filled in the space a to bridge the gap with a level difference 8 due to the thickness of the circuit wiring 3.