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Title:
電子部品およびその製造方法
Document Type and Number:
Japanese Patent JP7207030
Kind Code:
B2
Abstract:
To enhance airtightness of an electronic component and also enhance vibration resistance.SOLUTION: An electronic component includes an exterior case having an accommodation portion in which a first case member (6) having a first opening portion (23) covering an upper surface side of a lead terminal (12) and a second case member (8) having a second opening portion (32) covering a lower surface side of the lead terminal are joined to each other to accommodate an element, and a lead terminal lead-out portion for confronting the first opening portion and the second opening portion with each other, pinching the lead terminal by the overlapping first opening portion and the second opening portion, and protruding the lead terminal to the outside of the accommodation portion. Further, there are provided inclined surfaces that narrow the opening width in a direction in which the side surfaces of the first opening portion and the second opening portions are spaced apart from a joint portion of the first case member and the second case member, the opening width on the joint portion side of the first opening portion and the second opening portion is wider than that of the lead terminal, and the narrowest portion of the opening width is equal to or less than the width of the lead terminal.SELECTED DRAWING: Figure 3

Inventors:
Satoshi Oikawa
Yoshioka Toshiyasu
Application Number:
JP2019043849A
Publication Date:
January 18, 2023
Filing Date:
March 11, 2019
Export Citation:
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Assignee:
Nippon Chemi-Con Co., Ltd.
International Classes:
H01F27/02; H01F17/06; H01F27/29; H05K5/00; H05K5/02
Domestic Patent References:
JP57176722U
JP2013065746A
JP2016115883A
Foreign References:
WO2019044796A1
Attorney, Agent or Firm:
Shoichi Unemoto
Tsugitate Uemoto
Takuya Uemoto
Masaki Okita