Title:
電子部品とその製造方法
Document Type and Number:
Japanese Patent JP7313947
Kind Code:
B2
Abstract:
A housing 11 includes a concave portion 11a in which components are to be accommodated. A cover 12 covers the concave portion. A first laser-welded portion 17a is provided along a circumference of the concave portion of the housing and fixes the cover to the housing. The cover 12 includes an opening 12b positioned inside of the first laser-welded portion 17a and corresponding to a part of the circumference of the concave portion of the housing.
Inventors:
Tadashi Komuro
Shoto Kizu
Shoto Kizu
Application Number:
JP2019133927A
Publication Date:
July 25, 2023
Filing Date:
July 19, 2019
Export Citation:
Assignee:
Nidek Components Co., Ltd.
International Classes:
H01H9/02; B23K26/21; B29C65/16; F16B5/08; H01H11/00; H01H19/04; H05K5/00
Domestic Patent References:
| JP2013058380A | ||||
| JP2006236825A | ||||
| JP2009234070A | ||||
| JP2006007420A | ||||
| JP2007012728A |
Foreign References:
| WO2017047440A1 |
Attorney, Agent or Firm:
Suzue International Patent Office
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