Title:
ELECTRONIC COMPONENT AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP3182595
Kind Code:
B2
Abstract:
PURPOSE: To greatly improve the reliability of electronic components against thermal shock that is formed by mounting a plurality of circuit components on a circuit board 2 with terminal parts on its circumferential part, by bonding a lead-out lead on the terminal parts through soldering, and by covering the board 2 with a hard resin coating.
CONSTITUTION: When a resin coating 7 is applied to the electronic components, the thickness of a part 7b which covers the bonding part for a lead-out lead 5 on a circuit board 2 is made even larger than that of a part 7a which covers a component mounting part of composed circuit excluding it.
Inventors:
Takashi Kobayashi
Application Number:
JP9749693A
Publication Date:
July 03, 2001
Filing Date:
April 23, 1993
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L21/56; H01L23/28; H01L25/04; H01L25/18; H05K3/28; H05K3/40; (IPC1-7): H01L23/28; H01L21/56
Domestic Patent References:
| JP4107851A |
Attorney, Agent or Firm:
Minoru Yoshida (3 outside)
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