To provide an electronic component which uses a flexible element substrate, having an insulating film as its base material and which is less deformed because the flexible substrate is bent, even when it is subjected to a more or less external force.

A bent part 14C is provided on a lower side surface of a flexible element substrate 11 as opposed thereto from both sides of a part of the substrate, on which a conductive pattern 13C conducted with an element is provided, a support part 16C for carrying a lower surface of the conductive pattern 13C is provided to a reinforcing member 12 disposed under the substrate 11, the substrate 11 is embraced from its upper side by a coupling opposing part 20C of a connecting terminal 17C, so that a connecting part 19C is fixedly contacted with the pattern 13C.